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Long Au-wire on a PCB with 70 um pitch on the chip.
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A WLAN radio chip on a PCB based QFN substrate before molding.
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Demonstration of different wire length with 25 um Au wire. The longest wire is 7 000 um. Pitch on die is 90 um.
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MAK have long experience and knowledge in microelectronics, polymeric materials and microelectronic assembly. Our knowledge and experience enable us to help you if you have any special mold compound, potting, encapsulation or assembly requirements for your product.

MAK specializes in advanced IC assembly and prototyping services for fabless semiconductor companies, enabling faster time to market for new devices. The unique assembly requirements for Flip Chip, Chip-on-Board, stacked die, Multi-Chip Modules, System-in-Package, BGA and MEMS devices are addressed by MAK’s flexible processes and equipment, delivering prototypes to specification and on schedule.

MAK can handle prototypes as well as low to medium volume production and is the ideal partner for advanced IC assembly and prototyping, whether you need a complete turnkey solution or individual services. MAK provides unparalleled flexibility, quality and outstanding customer service.

We have done products for automotive, telecom, consumer, industrial, space and medical applications.

Some parts have been sent out in orbit around our globe, others might be mounted in your car and some are used in deep oceans…..

…..and what can we do for You?
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MA Kapslingsteknik AB
Västra Rydsvägen 130
SE-196 31 KUNGSÄNGEN
SWEDEN

Phone: +46 8 581 733 09
Email: info(at)mak.se


Demonstration of high loops, 1500 um, and long, 25um, Au wires on a ceramic substrate.
 
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